What is ultrafast laser processing? Ultrafast laser is a pulse laser with pulse width of picosecond level and below. 1 picosecond is equal to 10⁻¹² of a second, the speed of light in air is 3 X 10⁸m/s, and it takes about 1.3 seconds for light to travel from the Earth to the Moon. During the 1-picosecond time, the distance of light motion is 0.3mm. A pulse laser is emitted in such a short time that the interaction time between ultrafast laser and materials is also short. Compared with traditional laser processing, the heat effect of ultrafast laser processing is relatively small, so ultrafast laser processing is mainly used in fine drilling, cutting, engraving surface treatment of hard and brittle materials such as sapphire, glass, diamond, semiconductor, ceramics, silicone, etc.The high-precision processing of ultrafast laser equipment needs a high-precision chiller to cool. S&A high-power & ultrafast laser chiller, with temperature control stability of up to ±0.1℃, can provide fast and precise temperature control for ultrafast laser, meet the operating temperature conditions of the ultrafast laser in time and ensure the stable output of ultrafast laser in picosecond time. It works with the ultrafast laser, making breakthrough achievements in the frontier of fine processing.