Semiconductor material likes chip and integrated circuit board are key to develop 5G technology, micro-electronics, high-speed communication, smart automobile, high-end manufacturing and so on. It is closely related to the development of a country. Therefore, in the coming future, the demand of semiconductor material will continue to grow. To meet the manufacturing demand, the semiconductor processing equipment will experience a dramatic growth. These equipment include stepper, laser etching machine, thin-film depositional equipment, ion implanter, laser scribing machine, laser hole drilling machine and so on.
As what can be seen above, most of the semiconductor material processing machine is supported by laser technique. Laser light beam can have a unique effect in processing semiconductor material due to its non-contact, highly efficient and precise quality.
Many silicon-based wafer cutting job used to be done by mechanical cutting. But now, precision laser cutting takes the charge. Laser technique features high efficiency, smooth cutting edge and no need of further post-processing and without producing any pollutant. In the past, laser wafer cutting used nanosecond UV laser, since UV laser is characterized by small heat affecting zone and is known as cold processing. But in the recent years with the update of the equipment, ultrafast laser, especially picosecond laser has been gradually used in wafer laser cutting. With the power of ultrafast laser continues to increase, it is expected that picosecond UV laser and even femtosecond UV laser will be widely used to achieve more precise and faster processing.
In the near future, the semiconductor industry in our country will enter the fastest growing period, bringing huge demand of semiconductor equipment and the huge amount of wafer processing. These all help promote the demand of laser micro-machining, especially ultrafast laser.
Semiconductor, touch screen, consumer electronics parts manufacturing will be the most important applications of ultrafast laser. For the time being, domestic ultrafast laser is experiencing a rapid growth and price is going down. For example, for 20W picosecond laser, its price reduces from the original 1 million RMB to less than 400,000 RMB. This is a positive trend for the semiconductor industry.
The stability of the ultrafast processing equipment is closely related to the thermal management. Last year, S&A Teyu launched the portable industrial chiller unit CWUP-20 which can be used to cool femtosecond laser, picosecond laser, nanosecond laser and other ultrafast lasers. Find out more about this chiller at https://www.teyuchiller.com/portable-water-chiller-cwup-20-for-ultrafast-laser-and-uv-laser_ul5
